Currently, the leading edge of Modern Microprocessor fabrication is at the 3nm and 2nm nodes. This level of Microprocessor Technology requires Extreme Ultraviolet (EUV) lithography, a process so precise it can be compared to hitting a golf ball on the moon with a laser from Earth. These tiny transistors allow for more features, like integrated AI engines and 5G modems, to be placed directly on the processor die, making our devices smaller, faster, and more capable than ever before.